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壁仞科技据悉计划融资10亿美元

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9月15日,据The Information报道,中国AI芯片公司壁仞科技正计划筹集约10亿美元资金。此次融资规模较大,正值中国国产AI芯片厂商加速扩产、研发并争夺英伟达替代市场之际。相关融资计划目前仍处于筹备阶段。

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來源:https://raidenwire.com/fast/783394.html